|Place of Origin:||China|
|Minimum Order Quantity:||1 PCS|
|Packaging Details:||Vacuum packing|
|Payment Terms:||T/T ,Western Union,Paypal|
|Supply Ability:||50000SQ.M/Per Month|
|Surface Finish:||HAL LEAD FREE||Application:||Solar Equipment|
|Solder Mask:||Green||Copper Thickness:||1 Oz All Layer|
|Min. Hole Size:||8 Mil/6 Mil||Min. Line Spacing:||4mil|
|Min. Line Width:||4mil||Service:||Customized PCB|
1.62mm LED light PCB Board,
HAL Lead Free LED PCB Board,
FR4 solar light circuit board
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
Contact Person: sales