Products Application:
1, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;
2, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;
3, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;
4, Industrial controls: Medical device ,UPS equipment, Control device etc;
5, Vehicle Electronices: Car etc;
6, Military & Defense : Military Weapons etc;
Technology Capability:
| Item |
Technical Parameters |
| Layers |
1-28 Layers |
| Inner Layer Min Trace/Space |
4/4 mil |
| Out Layer Min Trace,Space |
4/4 mil |
| Inner Layer Max Copper |
4 OZ |
| Out Layer Max Copper |
4 OZ |
| Inner Layer Min Copper |
1/3 oz |
| Out Layer Min Copper |
1/3 oz |
| Min hole size |
0.15 mm |
| Max.board thickness |
6 mm |
| Min.board thickness |
0.2mm |
| Max.board size |
680*1200 mm |
| PTH Tolerance |
+/-0.075mm |
| NPTH Tolerance |
+/-0.05mm |
| Countersink Tolerance |
+/-0.15mm |
| Board Thickness Tolerance |
+/-10% |
| Min BGA |
7mil |
| Min SMT |
7*10 mil |
| Solder mask bridge |
4 mil |
| Solder mask color |
White,black,blue,green,yellow,red,etc |
| Legend color |
White,black,yellow,gray,etc |
| Surface finish |
HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG |
| Board materials |
FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB |
| Impedance control |
+/-10% |
| Bow and twist |
≤0.5 |
FAQ:
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
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