Place of Origin: | China |
Brand Name: | ACCPCB |
Certification: | ISO, UL, SGS,TS16949 |
Model Number: | P10062 |
Minimum Order Quantity: | 20PCS |
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Price: | Negotiable |
Packaging Details: | Vacuum packing with desiccant |
Delivery Time: | 8-15 Days |
Payment Terms: | L/C / D/A / T/T / Western Union |
Supply Ability: | 30,000SQ.M/PER MONTH |
Material: | FR4 TG150 | Thickness: | 2.20mm |
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Number Of Layers: | 6layer | Min. Line Spacing: | 0.1mm4mil) |
Silkscreen Color: | White/black/yellow/red/blue | Surface Finishing: | Lead Free HAL |
High TG PCB with fr4 tg150 2oz copper thickness for system power supply
Key Specifications/Special Features :
Layer : | 6 Layers |
Base Material : | KB FR4 TG150 |
Board Thickness : | 2.20mm |
Min. Hole Size : | 6mil / 0.15mm |
Min. Line Width : | 5 / 5 mil |
Min. Line Spacing : | 5 / 5 mil |
Surface Finishing : | HAL LEAD FREE |
Solder Mask Color : | Green |
Silkscreen color : | White |
Outline : | Routing + V-CUT |
Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
Application:
Industril Control System
Power Supply
LED drive, LED Lighting
Communication Device
automotive electronics
Security Electronics
Household Control
Digital Appliances
Frequency converter
Medical Device
Technology Capability:
Item | Technical Parameters |
Layers | 1-28 Layers |
Inner Layer Min Trace/Space | 4/4 mil |
Out Layer Min Trace,Space | 4/4 mil |
Inner Layer Max Copper | 4 OZ |
Out Layer Max Copper | 4 OZ |
Inner Layer Min Copper | 1/3 oz |
Out Layer Min Copper | 1/3 oz |
Min hole size | 0.15 mm |
Max.board thickness | 6 mm |
Min.board thickness | 0.2mm |
Max.board size | 680*1200 mm |
PTH Tolerance | +/-0.075mm |
NPTH Tolerance | +/-0.05mm |
Countersink Tolerance | +/-0.15mm |
Board Thickness Tolerance | +/-10% |
Min BGA | 7mil |
Min SMT | 7*10 mil |
Solder mask bridge | 4 mil |
Solder mask color | White,black,blue,green,yellow,red,etc |
Legend color | White,black,yellow,gray,etc |
Surface finish | HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG |
Board materials | FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB |
Impedance control | +/-10% |
Bow and twist | ≤0.5 |
Shipping Information:
FOB Port : Hong Kong / Shenzhen Lead Time : 8 - 15 days
HTS Code : 8534.00.10 Dimensions per Carton : 37X27X22mm
Weight Per Carton : 20 Kilograms
FAQ :
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
Contact Person: sales
Tel: +8615889494185