ITEQ FR4 UPS Blank High TG PCB vias With Resin Plugged Vias with immersion gold

ITEQ FR4 UPS Blank High TG PCB vias With Resin Plugged Vias with immersion gold
 
Production description :
this board is 4layer PCB with resin plugged vias.  we can accept PCB prototype,samll volum, middle and large volume . no MOQ request for new boards.
 
Key Specifications/Special Features :

 
Technology Capability :

 
 
Application:
Industril Control System
Power Supply
LED drive, LED Lighting
Communication Device
automotive electronics
Security Electronics
Household Control
Digital Appliances
Frequency converter
Medical Device
 
Shipping Information:
FOB Port : Hong Kong / Shenzhen                                     Lead Time : 8 - 15 days
HTS Code : 8534.00.10                                    Dimensions per Carton : 37X27X22mm
Weight Per Carton : 20 Kilograms
 
FAQ :
1. How do ACCPCB ensure quality?
   Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
  Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
   PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
    Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How many types of surface finish ACCPCB can do?
   the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
6. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;