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| Place of Origin: | China |
| Brand Name: | ACCPCB |
| Certification: | ISO, UL, SGS,TS16949 |
| Model Number: | P111615 |
| Minimum Order Quantity: | 10PCS |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Vacuum packing with desiccant |
| Delivery Time: | 10-12days |
| Payment Terms: | L/C / T/T / Western Union / Paypal |
| Supply Ability: | 30,000SQ.M/Per Month |
| Material: | KBFR4 Tg180 | Thickness: | 1.60mm |
|---|---|---|---|
| Surface Finish: | Gold Plating | Layer: | 8L |
| Pcb Standard: | IPC-A-610 D | Usage: | OEM Electronics |
| Copper Thickness: | 1oz | Min. Line Spacing: | 0.2mm |
| Min. Hole Size: | 0.1mm | Product Name: | Printed Circuit Board |
| Solder Mask: | Green. Red. Blue. White. Black.Yellow | Type: | OEM PCB,customized PCB |
| High Light: | tg180 High TG PCB,fr4 High TG PCB,ITEQ High TG PCB |
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8 Layer ITEQ Fr4 Tg180 High TG PCB With Gold Plating Surface Finishing
Production description :
this board is 8 layer with 1 oz copper thickness.PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new order. all of these boards are met UL,TS16949, ISO9001 Etc.
Key Specifications/Special Features :
| Layer : | 6 Layers |
| Base Material : | KBFR4 tg180 |
| Copper Thickness : | 1oz in all layer |
| Board Thickness : | 1.60mm |
| Min. Hole Size : | 9 mil |
| Min. Line Width : | 5 mil |
| Min. Line Spacing : | 5 /mil |
| Surface Finishing : | gold plating |
| Solder Mask Color : | Green |
| Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
| Silkscreen color : | White |
| Outline profile : | Routing, punching |
| Twist and bow : | 0.75% |
| Immpedance control : | +/- 10% |
| Solder mask : | LPI solder mask, peelable mask |
ACCPCB Technical Capability.pdf
Products Application:
1, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;
2, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;
3, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;
4, Industrial controls: Medical device ,UPS equipment, Control device etc;
5, Vehicle Electronices: Car etc;
6, Military & Defense : Military Weapons etc;
1. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
2. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
3. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
4. How many types of surface finish ACCPCB can do?
O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
Contact Person: sales
Tel: +8615889494185
