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| Place of Origin: | China |
| Brand Name: | ACCPCB |
| Certification: | ISO, UL, SGS,TS16949 |
| Model Number: | P11342 |
| Minimum Order Quantity: | 1 pcs |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Vacuum packing with desiccant |
| Delivery Time: | 5-8DAS |
| Payment Terms: | L/C / T/T / Western Union / Paypal |
| Supply Ability: | 30000SQ.M/PER MONTH |
| Base Material: | KBfr4 | Count Layer: | 4layer |
|---|---|---|---|
| Copper Thickness: | 1 / 1 / 1 / 1 OZ In All Layer | Finish Board Thickness: | 1.80mm |
| Solder Mask: | Green | Min Line Space: | 0.10mm |
| Min Line Width: | 0.10mm | Outline Profile: | Cnc Routing +V-cuting |
| Twist And Bow: | No More Than 0.75% | ||
| High Light: | 1.80mm Multilayer Circuit Board,Tg130 Multilayer Circuit Board,Green Fr4 Multilayer PCB |
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Green Fr4 Tg130 1.80mm Multilayer Circuit Board For Led Driver
Production description :
this board is double sided layer. it is use for LED driver . no MOQ request for new order. all of our PCB are met UL, TS 16949,ROHS, ISO Etc. certification.we can accept prototype ,small volume , middle volume and large volume.
Key Specifications/Special Features:
| Layer count: | four sided |
| Base material : | Fr4tg130 |
| Copper thickness : | 1 oz in all layer |
| Board thickness : | 1.80mm |
| Min. hole size : | 0.2mm |
| Min. line width : | 5 mils |
| Min. line spacing : | 5 mils |
| Surface finishing : | HAL lead free |
| Application : | Led driver |
| Board thickness tolerance : | ±10% |
| Twist& wrap : | ≤ 0.5% |
| Outline profile: | Punching, Routing , CNC routing + V-cut |
| Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
| Silkscreen color : | White |
| Twist and Bow : | no more than 0.75 % |
| Copper thickness in hole: | 0.02-0.035mm |
Rigid PCB Technical Capability:
| Items | Technical Capability | ||
| Layers | 1-28 layers | Min. line width/space | 4mil |
|
Max.board size (single&doule sided) |
600*1200mm | Min.annular ring width: vias | 3mil |
| Surface finish |
HAL lead free,gold flash Immersion silver,Immersion gold ,Immersion Sn, hard gold,OSP,ect |
Min.board thickness(multilayer) | 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
|
| Board materials |
FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic, PTFE,nelcon, ISOLA,polyclad 370 HR); heavy copper, Metal base clade laminate |
Plating thickness (Technique: Immersion Ni/Au) |
Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U'' |
| Impedance control | ± 10% |
Distance between line to board edge |
Outline: 0.2mm V-CUT: 0.4mm |
|
Base copper thickness(Inner and outer layer) |
Min. thickness: 0.5 OZ Max.thickness: 6OZ | Min.hole size(board thickness ≥2mm) | Aspect ratio≤16 |
| Finished copper thickness | Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
|
Max.board thickness(single&doule sided) | 3.20mm |
Full range of testing services:
▪ AOI, function testing, In circuit testing, X-ray for BGA testing
▪ 3D paste thickness test
▪ Flash testing and earth bonding tests can also be undertaken where required
▪ Using our X-ray machine, we test PCBs to component level and all wiring is fully inspected and tested
▪ Each board is carefully examined by our dedicated inspection team using AOI and high magnification viewers
Application:
Widely used in stage, Industrila control,computer,consuming electronics,security,automotive,power electronics,medical,telecom etc.
FAQ :
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.
Contact Person: sales
Tel: +8615889494185
