Place of Origin: | China |
Brand Name: | ACCPCB |
Certification: | ISO, UL, SGS,TS16949 |
Model Number: | S120712 |
Minimum Order Quantity: | 1PCS |
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Price: | Negotiable |
Packaging Details: | Vacuum packing with desiccant |
Delivery Time: | 10-12days |
Payment Terms: | L/C / T/T / Western Union / Paypal |
Product Name: | Multilayer Rigid Boards | Thickness: | 1.0mm |
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Size: | 150mmX100mm | Min. Line Spacing: | 0.1MM / 4MIL |
Board Thickness: | 0.5~3.2mm | Surface Finishing: | HAL LEAD FREE, Immersion Gold,immersion Silver /TIN |
Copper Thickness: | 0.5oz-6oz | Min Line Spacing: | 4mil (0.1mm) |
Min.line Width: | 4 Mil ( 0.1mm) | Min Drill Hole Size: | 0.2mm |
High Light: | TG170 Multilayer PCB Board,FR4 Multilayer PCB Board,FR4 0.5 Oz Green PCB |
0.5 Oz Green Solder Mask FR4 TG170 Multilayer PCB Board
FR4 TG170 Material Multilayer PCB board green soldermask for amplifier pcb board
Production description :
this board is 6layer with 4oz copper thickness. it is used on amplifier. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new boards.
Production Types: | Rigid PCB |
Layer : | Multilayer |
Base Material : | FR4 tg170 |
Copper Thickness : | 4 oz |
Board Thickness : | 1.0mm |
Min. Finish Hole Size : | 8 mil (0.10mm) |
Min. Line Width : | 4 mil |
Min. Line Spacing : | 4 mil |
Surface Finishing : | ENIG,OSP,HASL,Immersion Gold,Gold Plating |
Drilling hole tolerance: | +/-3 mil ( 0.075mm ) |
Min Outline tolerance : | +/-4 mil ( 0.10mm ) |
Working panel size : | max:1200mmX600mm (47'' X24'') |
Outline profile: | Punching, Routing , CNC routing + V-cut |
Solder mask : | LPI Solder mask, Peelable mask |
Solder Mask Color : | Blue, black,yellow, matte green |
Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
Silkscreen color : | White |
Twist and Bow : | no more than 0.75 % |
Products Application:
Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consuming, computer, automotive, aerospace, military and so on.
Advantages :
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery
Technical Capability:
ITEMS | Capability |
Max. layer count | 28L |
Min. line widty | 0.08mm |
Min. line spacing | 0.08mm |
Min. hole size | 0.15mm |
Board thickness | 0.4-6.0mm |
Max. boardsize | 520×620mm |
(PTH) Hole size tolerance(PTH) | ±0.075mm |
(NPTH) Hole size tolerance(NPTH) ) | ±0.05mm |
Holeposition tolerance(Routing) | ±0.1mm |
Outline tolerance(Punching) | ±0.1mm |
FAQ:
1. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
2. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
6. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
Contact Person: sales
Tel: +8615889494185