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PWB Printed Circuit Board Assembly High CTI Material For Electronic Device Application

PWB Printed Circuit Board Assembly High CTI Material For Electronic Device Application

PWB Printed Circuit Board Assembly High CTI Material For Electronic Device Application
PWB Printed Circuit Board Assembly High CTI Material For Electronic Device Application
PWB Printed Circuit Board Assembly High CTI Material For Electronic Device Application
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO,UL,SGS,TS16949,ROHS
Model Number: P1221
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum Packing With Desiccant
Delivery Time: 6-10days
Payment Terms: T/T / Western Union / Paypal
Supply Ability: 35,000SQ.M/Per Month
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Detailed Product Description
Finish Thickness: 1.60±10%mm Minimum Via Dia: 0.2mm
Surface Finish: Immersion Gold Material: ITEQ FR4
Application: Medical Sphygmomanometer Solder Mask: Red
High Light:

pwb printed wiring board

,

pwb assembly

PWB Printed Circuit Board Assembly High CTI Material for Electronic Device Application

 

Our PCB order capability:   

Layer :

up to 20 layers

Materials : FR-4, FR4 High Tg/ High CTI Material
TG :

130-180

Surface :

HASL LF , Immersion Gold/Silver/Tin, OSP, Gold Plated

Min drill size : 0.10mm
Min track/spacing :

4/4-mil

Buried and blind via : 0.15MM
Outline :

CNC Milling and V-cut

Solder mask colors : Green, Blue, Black, White, Red and Yellow, Matte green, Matte black, Matte Blue
Silkscreen colors :

black, white and yellow

Impedance control

 yes

Blue Peelable Mask

 yes
Company type: Manufacturer/ Factory
Outline: Routing,V-Groove, Beveling punch

  

Main Export Markets:

  • Asia
  • Australasia
  • Central/South America
  • Eastern Europe
  • Mid East/Africa
  • North America
  • Western Europe
  •  

 

Shipping Information :

FOB Port :  Hong Kong / Shenzhen 

Lead Time :  6-10 days

HTS Code :  8534.00.10 

Dimensions Per Carton : 37X27X22 cm

Weight Per Carton : 20 Kilograms

                       

FAQ:
1. What kinds of boards can ACCPCB process?

    Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


2. What data are needed for PCB production?

    PCB Gerber files with RS-274-X format.


3. What’s the typical process flow for multi-layer PCB?

     Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating →       Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T →         Visual Inspection.


4. How many types of surface finish ACCPCB can do?

    the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating,      immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

 

5. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

 

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Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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