FR4 TG170 PWB Printed Wiring Board Black Oil For Security Monitoring Equipment

FR4 TG170 PWB Printed Wiring Board Black Oil For Security Monitoring Equipment

Production description :

this board is 8layer with 1oz copper thickness. it is used on bluetooth device. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new order. all of these boards are met UL,TS16949, ISO9001 Etc.

Key Specifications/Special Features:

Here is our PCB order capability:

• Layer : up to 20 layers

• Materials : FR-4,  FR4 High Tg/ High CTI Material

• TG : 130-170

• Surface : HASL LF , Immersion Gold/Silver/Tin, OSP, Gold Plated

• Min drill size : 0.10mm

• Min track/spacing : 4/4-mil

• Buried and blind via : 0.2mm

• CNC Milling and V-cut

• Solder mask colors : Green, Blue, Black, White, Red and Yellow, Matte green, Matte black, Matte Blue

• Silkscreen colors : black, white and yellow

• Half Holes

• Impedance control

• Blue Peelable Mask

• Carbon Treated

• HDI available

Main Export Markets:

• Asia

• Australasia

• Central/South America

• Eastern Europe

• Mid East/Africa

• North America

• Western Europe

Shipping Information :

FOB Port :  Hong Kong / Shenzhen 

Lead Time :  6-10 days

HTS Code :  8534.00.10 

Dimensions Per Carton : 37X27X22 cm

Weight Per Carton : 20 Kilograms

FAQ :

1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.

4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

5. How many types of surface finish ACCPCB can do?

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

6. How to you make the impedance calculation?

The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.