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SMT FR4 PCB Board HDI PCB Board 4 layer pcb for 5G electronic insturment

SMT FR4 PCB Board HDI PCB Board 4 layer pcb for 5G electronic insturment

SMT FR4 PCB Board HDI PCB Board 4 layer pcb for 5G electronic insturment
SMT FR4 PCB Board HDI PCB Board 4 layer pcb for 5G electronic insturment
SMT FR4 PCB Board HDI PCB Board 4 layer pcb for 5G electronic insturment
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1145
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 15-20days
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 25000SQ.M/PER MONTH
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Detailed Product Description
Material: NYFR4TG180 Layer: 4-layer
Feature: ENIG Copper Thickness: 3oz Inner Layer / 30oz Outlayer
Board Thickness: 2.0MM
High Light:

high density interconnect pcb

,

double sided copper clad board

SMT FR4 PCB Board HDI PCB Board 4 layer pcb for 5G electronic insturment​
 

Production description :

this board is 4layer PCB it is used on electronic instrument. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new boards. All PCB are passed UL, TS16949, ROHS ,ISO9001 etc. Certification.

 

 

Key Specifications/Special Features:

Items Parameter Special
Layers Counts 2-20  
Board material FR-4,Aluminum High Tg FR4
max Fabrication area 580×700mm 500mm×3000mm
Board thickness 0.1-3.2mm  
Camber Double Side
multi -layers
d0.075mm
d1%
d0.05mm
Impedance ±7% ±5%
PTH tolerance d>5.0 ±0.076mm  
0.3<d5.0 ±0.05mm  
d0.3 ±0.08mm  
Min finished hole size 0.15mm  
Hole copper thickness 20um  
Min track width, spacing 0.05mm ×0.05mm  
Profile size ±0.1mm ±0.05mm
Profile Routing,Punch,Cut,V-cut,Chanfer  
Surface finish Immersion Gold:0.025~0.075um  
Gold finger:≥0.13 um 1.0 um
OSP:0.2-0.5µm  
HAL:5~20 um  
LEADFREE HAL:5~20 um  
Surface plating Solder mask: Black Green White Red Thickness≥17 um,Block,BGA
Character : Black Yellow Green White style: Highness≥0.0.625mm Width≥0.125mm
Ppeelable mask: red bule thickness300 um
Carbonink : Black thickness25 um Highness≥0.30mm Width≥0.3mm


 
Lead Time:

Types

 

(Max ㎡/month)

Samples

(days)

Mass Production(days)
New PO Repeat PO Urgent
2layer 50000 sq.m/month 2-3 10-11 8-9 4
4layer 5-6 11-12 9-11 5
6layer 6-7 13-14 12-14 6
8layer 7-8 16-18 14-15 7

 

Main Export Markets:

  • Asia
  • Australasia
  • North America
  • Western Europe

 
Advantages :
•  Strict product liability, taking IPC-A-160 standard
•  Engineering pretreatment before production
•  Production process control (5Ms)
•  100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
•  100% AOI inspection, including X-ray, 3D microscope and ICT
•  High-voltage test, impedance control test
•  Micro section, soldering capacity, thermal stress test, shocking test
•  In-house PCB production
•  No minimum order quantity and free sample
•  Focus on low to medium volume production
•  Quick and on-time delivery 

 

FAQ:

1. What kinds of boards can ACCPCB process?

   Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


2. What data are needed for PCB production?

   PCB Gerber files with RS-274-X format.


3. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


4. How many types of surface finish ACCPCB can do?

   the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

 

5. How do ACCPCB ensure quality?

  Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

 

SMT FR4 PCB Board HDI PCB Board 4 layer pcb for 5G electronic insturment 0

 

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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