8layer electronics HDI Board with immersion gold and Green Color High Performance

8layer electronics HDI Board with immersion gold and Green Color High Performance
 

Production Description:

It is 8L with blinded and buired vias board. it is used for wifi mobile phone. all of PCB have UL, CE , ROHS, TS16949 Certification. no MOQ request for new orders.

PCB Flow Chart.pdf

Production Features of HDI boards :

Technology Capability:

Products Application:

1, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

2, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

3, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

4, Vehicle Electronices: Car etc;

5, Industrial controls: Medical device ,UPS equipment, Control device etc;

6, Military & Defense : Military Weapons etc;

Lead Time:

Advantages :
•  Strict product liability, taking IPC-A-160 standard
•  Engineering pretreatment before production
•  Production process control (5Ms)
•  100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
•  100% AOI inspection, including X-ray, 3D microscope and ICT
•  High-voltage test, impedance control test
•  Micro section, soldering capacity, thermal stress test, shocking test
•  In-house PCB production
•  No minimum order quantity and free sample
•  Focus on low to medium volume production
•  Quick and on-time delivery 
 

FAQ:

1. How do ACCPCB ensure quality?

  Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

  Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?

   PCB Gerber files with RS-274-X format.

4. What’s the typical process flow for multi-layer PCB?

   Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

5. How many types of surface finish ACCPCB can do?

   the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.