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| Place of Origin: | China |
| Brand Name: | ACCPCB |
| Certification: | ISO, UL, SGS,TS16949 |
| Model Number: | P1135 |
| Minimum Order Quantity: | 1 PCS |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Vacuum packing with desiccant |
| Delivery Time: | 15-20days |
| Payment Terms: | L/C / T/T / Western Union / Paypal |
| Supply Ability: | 25000SQ.M/PER MONTH |
| Key Words: | High Density Interconnector | Material: | FR4 TG150 |
|---|---|---|---|
| Layer: | 4-layer PCB With 1+N+1 HDI Structure | Feature: | HAL Lead Free |
| Copper Thickness: | 1oz Inner Layer / 2oz Outlayer | Board Thickness: | 0.2-6.0mm |
| High Light: | double sided copper clad board,hdi circuit boards |
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4 Layer HDI PCB Board 1+N+1 Structure Blue Solder Mask HAL Lead Free
Key Specifications/Special Features:
Layer : 4 Layers
Base Material : FR4 tg150
Copper Thickness : 2 / 1 / 1 / 2oz,
Board Thickness : 1.6mm
Min. Hole Size : 4 mil, 0.1mm
Solder mask : blue
BGA pad size : 0.25mm
Line width/space : 5.0 / 5.0mil
Laser via holes from : L1 to L2,
Application : Aerospace application
Technology Capability:
| Item | Technical Parameters |
| Layers | 1-28 Layers |
| Inner Layer Min Trace/Space | 4/4 mil |
| Out Layer Min Trace,Space | 4/4 mil |
| Inner Layer Max Copper | 4 OZ |
| Out Layer Max Copper | 4 OZ |
| Inner Layer Min Copper | 1/3 oz |
| Out Layer Min Copper | 1/3 oz |
| Min hole size | 0.15 mm |
| Max.board thickness | 6 mm |
| Min.board thickness | 0.2mm |
| Max.board size | 680*1200 mm |
| PTH Tolerance | +/-0.075mm |
| NPTH Tolerance | +/-0.05mm |
| Countersink Tolerance | +/-0.15mm |
| Board Thickness Tolerance | +/-10% |
| Min BGA | 7mil |
| Min SMT | 7*10 mil |
| Solder mask bridge | 4 mil |
| Solder mask color | White,black,blue,green,yellow,red,etc |
| Legend color | White,black,yellow,gray,etc |
| Surface finish | HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG |
| Board materials | FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB |
| Impedance control | +/-10% |
| Bow and twist | ≤0.5 |
Products Application:
1, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;
2, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;
3, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;
4, Industrial controls: Medical device ,UPS equipment, Control device etc;
5, Vehicle Electronices: Car etc;
6, Military & Defense : Military Weapons etc;
Lead Time:
| Types |
(Max ㎡/month) |
Samples (days) |
Mass Production(days) | ||
| New PO | Repeat PO | Urgent | |||
| 2layer | 50000 sq.m/month | 2-3 | 10-11 | 8-9 | 4 |
| 4layer | 5-6 | 11-12 | 9-11 | 5 | |
| 6layer | 6-7 | 13-14 | 12-14 | 6 | |
| 8layer | 7-8 | 16-18 | 14-15 | 7 | |
Advantages :
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery
FAQ:
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
5. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
6. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
Product Show :
Contact Person: sales
Tel: +8615889494185
