|Place of Origin:||China|
|Minimum Order Quantity:||1 PCS|
|Packaging Details:||Vacuum Packing With Desiccant|
|Payment Terms:||T/T / Western Union / Paypal|
|Supply Ability:||35,000SQ.M/Per Month|
|Layer Count:||8 Layer||Finish Thickness:||1.2±10%mm|
|Minimum Via Dia:||0.1mm||Holes Feature:||Laser Dril|
|Surface Finish:||Immersion Gold||Material:||KB FR4|
pwb printed wiring board,
Production description :
this board is 8layer with 2oz copper thickness. it is used for monitor equipment. we can accept any quantity board such as PCB prototype,samll volum, middle and large volume . no MOQ request for new order. all of these boards are met UL,TS16949, ISO9001 Etc.
|Layer count :||
Minimum via dia :
L1-2, L2-3, L4-5
|L2-5:||Buried vias resin filled|
differential impedance of 100±9Ω
|Outline:||Routing,V-Groove, Beveling punch|
|Company type:||Manufacturer/ Factory|
Here is our PCB order capability:
1. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
2. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
3. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
4. How many types of surface finish ACCPCB can do?
O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
Contact Person: sales