Place of Origin: | China |
Brand Name: | ACCPCB |
Certification: | ISO, UL, SGS,TS16949 |
Model Number: | P1100 |
Minimum Order Quantity: | 20PCS |
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Price: | Negotiable |
Packaging Details: | Vacuum packing with desiccant |
Delivery Time: | 8-15 Days |
Payment Terms: | L/C / D/A / T/T / Western Union |
Supply Ability: | 30,000SQ.M/PER MONTH |
Material: | FR4 TG150 | Thickness: | 1.80mm |
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Size: | 100mmX260mm | Number Of Layers: | 6layer |
Min. Line Spacing: | 0.1mm4mil) | Surface Finishing: | Gold Plating |
High Light: | dc dc converter pcb,lcd display pcb |
OEM ODM High TG PCB 0.8mm thickness 0.2mm holes size and lead free HAL 2oz copper thickness
Key Specifications/Special Features :
Layer : | 4Layers |
Base Material : | Nanya FR4TG150 |
Holes : | Buried and Blinded holes |
Board Thickness : | 1.80mm |
Min. Hole Size : | 6mil, 0.15mm |
Min. Line Width : | 4/4 mil |
Min. Line Spacing : | 4/4mil |
Surface Finishing : | Lead Free HAL |
Solder Mask Color : | Green ,Red,Blue,White,Yellow,Red |
Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
Silkscreen color : | White,Yellow,Red,Black |
Outline : | Routing,V-Groove, Beveling punch |
Application:
Industril Control System
Power Supply
LED drive, LED Lighting
Communication Device
automotive electronics
Security Electronics
Household Control
Digital Appliances
Frequency converter
Medical Device
Technology Capability:
Item | Technical Parameters |
Layers | 1-28 Layers |
Inner Layer Min Trace/Space | 4/4 mil |
Out Layer Min Trace,Space | 4/4 mil |
Inner Layer Max Copper | 4 OZ |
Out Layer Max Copper | 4 OZ |
Inner Layer Min Copper | 1/3 oz |
Out Layer Min Copper | 1/3 oz |
Min hole size | 0.15 mm |
Max.board thickness | 6 mm |
Min.board thickness | 0.2mm |
Max.board size | 680*1200 mm |
PTH Tolerance | +/-0.075mm |
NPTH Tolerance | +/-0.05mm |
Countersink Tolerance | +/-0.15mm |
Board Thickness Tolerance | +/-10% |
Min BGA | 7mil |
Min SMT | 7*10 mil |
Solder mask bridge | 4 mil |
Solder mask color | White,black,blue,green,yellow,red,etc |
Legend color | White,black,yellow,gray,etc |
Surface finish | HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG |
Board materials | FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB |
Impedance control | +/-10% |
Bow and twist | ≤0.5 |
FAQ :
1. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
2. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
3. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
4. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
Contact Person: sales
Tel: +8615889494185