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| Place of Origin: | China |
| Brand Name: | ACCPCB |
| Certification: | ISO, UL, SGS,TS16949 |
| Model Number: | P1134 |
| Minimum Order Quantity: | 1 PCS |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Vacuum packing with desiccant |
| Delivery Time: | 15-20days |
| Payment Terms: | L/C / T/T / Western Union / Paypal |
| Supply Ability: | 25000SQ.M/PER MONTH |
| Key Words: | High Density Interconnector | Material: | FR4 TG180 |
|---|---|---|---|
| Layer: | 10-layer PCB With 2+N+2 HDI Structure | Apply For: | Main Board |
| Feature: | Immersion Gold(au:2u'') | Advantage: | High Quality And Fast Lead Time |
| High Light: | double sided copper clad board,hdi circuit boards |
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Multilayer HDI PCB Board Prototype Fabrication 1.2 MM Thickness with Immersion Gold surface
Key Specifications/Special Features:
Layer : 10Layers
Base Material : FR4 halogen free
Copper Thickness : 1/1/1/1/1/1/1/1/1/1oz,
Board Thickness : 1.2mm
Min. Hole Size : 6 mil, 0.15mm
Impedance control : 50 ohm
BGA pad size : 0.28mm
Line width/space : 4.0/5.0mil
Buried holes from : L3 to L10
Laser via holes from : L1 to L2, L2 to L3,
Application : Smart home application
Rigid PCB Technical Capability:
| Items | Technical Capability | ||
| Layers | 1-28 layers | Min. line width/space | 4mil |
|
Max.board size (single&doule sided) |
600*1200mm | Min.annular ring width: vias | 3mil |
| Surface finish |
HAL lead free,gold flash Immersion silver,Immersion gold ,Immersion Sn, hard gold,OSP,ect |
Min.board thickness(multilayer) | 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
|
| Board materials |
FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic, PTFE,nelcon, ISOLA,polyclad 370 HR); heavy copper, Metal base clade laminate |
Plating thickness (Technique: Immersion Ni/Au) |
Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U'' |
| Impedance control | ± 10% |
Distance between line to board edge |
Outline: 0.2mm V-CUT: 0.4mm |
|
Base copper thickness(Inner and outer layer) |
Min. thickness: 0.5 OZ Max.thickness: 6OZ | Min.hole size(board thickness ≥2mm) | Aspect ratio≤16 |
| Finished copper thickness | Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
|
Max.board thickness(single&doule sided) | 3.20mm |
Lead Time:
| Types |
(Max ㎡/month) |
Samples (days) |
Mass Production(days) | ||
| New PO | Repeat PO | Urgent | |||
| 2layer | 50000 sq.m/month | 2-3 | 10-11 | 8-9 | 4 |
| 4layer | 5-6 | 11-12 | 9-11 | 5 | |
| 6layer | 6-7 | 13-14 | 12-14 | 6 | |
| 8layer | 7-8 | 16-18 | 14-15 | 7 | |
Advantages :
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery
FAQ:
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
5. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.
Product Show :
Contact Person: sales
Tel: +8615889494185
