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3OZ Copper Heavy Copper PCB Board LEAD FREE HAL For Power Products

3OZ Copper Heavy Copper PCB Board LEAD FREE HAL For Power Products

3OZ Copper Heavy Copper PCB Board LEAD FREE HAL For Power Products
3OZ Copper Heavy Copper PCB Board LEAD FREE HAL For Power Products
3OZ Copper Heavy Copper PCB Board LEAD FREE HAL For Power Products
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1210132
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 12-15Days
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 30000SQ.M/PER MONTH
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Detailed Product Description
Number Of Layer: 4L Material: Nanya FR4
Finish Copper Thickness: 3oz In All Layer Surface Finish: HAL Lead Free
Min Holes: 0.25mm Application: Power Equipment
Board Thickness: 0.4~3mm Copper Thickness: Standard
Min. Line Spacing: 4mil Min. Line Width: 4 Mil
High Light:

3OZ Heavy Copper PCB Board

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0.25mm Heavy Copper PCB Board

3OZ Copper Heavy Copper PCB Board LEAD FREE HAL For Power Products

 

Production description :

 

this board is heavy cooper boad with 3oz for power produciton. all of our board are met UL, ISO9001, TS1694 certification etc.no MOQ request for new boards, for repeat order, just meet 3sq.m.

 

PCB Flow Chart.pdf
 
Production Feature :

Layer : 4 Layers
Base Material : Nanya FR4 
Copper Thickness : 3 oz 
Board Thickness : 1.60 mm
Min. Hole Size : 0.25 mm
Min. Line Width : 0.12 / 0.12 mm
Min. Line Spacing : 0.12 / 0.12 mm
Surface Finishing : Lead free HAL
Solder Mask Color : Green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
PTH tolerance : +/-3mil
NPTH tolerance : +/-2mil
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Twist and Bow : no more than 0.75 %
Silkscreen color : white

 
 
Company description :
 
ACCPCB is a high-tech enterprise specializing in the production and sales of double-sided and multi-layer rigid circuit boards in Boluo County, Huizhou City. It has an independent property factory of about 20,000 square meters, more than 500 employees, and an annual design production capacity of 500,000 square meters. The company has passed ISO9001 and ISO14000 quality and environmental system certification, and has obtained UL certification of the United States. The process capability is comprehensive and the technical strength is strong. The products fully comply with the EU RoHS directive green environmental protection requirements. The company aims to become a first-class professional circuit board manufacturer, providing the highest quality products and services based on quality assurance, we listen to the voice of our customers, establish a good relationship with all customers, and make progress together and grow together.
 

 

 

Advantages:
 
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery
 

 

FAQ
 

1. What kinds of boards can ACCPCB process?
 
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


2. What data are needed for PCB production?
 PCB Gerber files with RS-274-X format.


3. What’s the typical process flow for multi-layer PCB?
 
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


4. How many types of surface finish ACCPCB can do?
 
O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.



 

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Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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