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| Place of Origin: | China |
| Brand Name: | ACCPCB |
| Certification: | ISO, UL, SGS,TS16949 |
| Model Number: | P1116129 |
| Minimum Order Quantity: | 10PCS |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Vacuum packing with desiccant |
| Delivery Time: | 10-12days |
| Payment Terms: | L/C / T/T / Western Union / Paypal |
| Supply Ability: | 30,000SQ.M/Per Month |
| Material: | FR4 TG170 | Thickness: | 0.8mm |
|---|---|---|---|
| Surface Finish: | ENIG | Layer: | 4L |
| Copper Thicknes:: | 10Z | PCB Standard: | IPC-A-610 D |
| Type: | Customized PCB | Min Holes Size: | 4mil |
| Min. Line Width: | 4mil | Min Copper Thicness: | 20um |
| Solder Mask Color: | Green,yellow, Red, Black Etc. | Application: | Antenna Equipment |
| High Light: | TG170 Prototype PCB Board,4 Layer Prototype PCB Board,TG170 4 Layer PCB Board |
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4 Layer FR4 TG170 Prototype PCB Board 0.8mm Thickness With Blind Buried Via
Production description :
this board is 4 layer with 1oz copper thickness. it is used for antenna equipment. PCB prototype,small volum, middle and large volume are accepted. no MOQ request for new boards. for repeat order, just meet 3sq.m.
Key Specifications of High Voltage PCB:
| Production Types: | high TG Rigid PCB |
|
Layer : |
4 Layers |
| Base Material : | FR4 tg170 |
| Copper Thickness : | 1oz |
| Board Thickness : | 0.80 mm |
| Min. Finish Hole Size : | 8 mil (0.10mm) |
| Min. Line Width : | 4 mil |
| Min. Line Spacing : | 4 mil |
| Surface Finishing : | ENIG |
| Drilling hole tolerance: | +/-3 mil ( 0.075mm ) |
| Min Outline tolerance : | +/-4 mil ( 0.10mm ) |
| Working panel size : | max:1200mmX600mm (47'' X24'') |
| Outline profile: | Punching, Routing , CNC routing + V-cut |
| Solder mask : | LPI Solder mask, Peelable mask |
| Solder Mask Color : | Blue, black,yellow, matte green |
| Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
| Silkscreen color : | White |
| Twist and Bow : | no more than 0.75 % |
Products Application:
Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consum electronics, computer, automotive, aerospace, military and so on.
Rigid PCB Technical Capability:
| Items | Technical Capability | ||
| Layers | 1-28 layers | Min. line width/space | 4mil |
|
Max.board size (single&doule sided) |
600*1200mm | Min.annular ring width: vias | 3mil |
| Surface finish |
HAL lead free,gold flash Immersion silver,Immersion gold ,Immersion Sn, hard gold,OSP,ect |
Min.board thickness(multilayer) | 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
|
| Board materials |
FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic, PTFE,nelcon, ISOLA,polyclad 370 HR); heavy copper, Metal base clade laminate |
Plating thickness (Technique: Immersion Ni/Au) |
Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U'' |
| Impedance control | ± 10% |
Distance between line to board edge |
Outline: 0.2mm V-CUT: 0.4mm |
|
Base copper thickness(Inner and outer layer) |
Min. thickness: 0.5 OZ Max.thickness: 6OZ | Min.hole size(board thickness ≥2mm) | Aspect ratio≤16 |
| Finished copper thickness | Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
|
Max.board thickness(single&doule sided) | 3.20mm |
FAQ :
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
Contact Person: sales
Tel: +8615889494185
