Name: 1.380mm High Density 1 Oz Copper Pcb 4mil Min Line Gold Plating
Brand: ACCPCB
SKU: S1021334

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1.380mm High Density 1 Oz Copper Pcb 4mil Min Line Gold Plating

Product Details:

Place of Origin:	China
Brand Name:	ACCPCB
Certification:	ISO,SGS,TS16949
Model Number:	S1021334

Payment & Shipping Terms:

Minimum Order Quantity:	1 PCS
Price:	Negotiable
Packaging Details:	Vacuum packing
Delivery Time:	3-5days
Payment Terms:	T/T ,Western Union,Paypal
Supply Ability:	50000SQ.M/Per Month

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Detailed Product Description

Material:	ITEQFR4	Count:	6 Rigid Layer
Surface Finish:	Immersion Gold	Application:	Bluetooth Device
Solder Mask:	Red	Copper Thickness:	1oz All Layer
Min. Hole Size:	8 Mil/6 Mil	Min. Line Spacing:	4mil
Min. Line Width:	4mil	Service:	Customized PCB
High Light:	High Density 1 Oz Copper Pcb , 1.380mm High Density Pcb , 4mil High Density circuit board

1.380mm High Density 1 Oz Copper Pcb 4mil Min Line Gold Plating

Production description :

this board is 4layer with 1oz copper thickness. it is used on bluetooth device. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new order. all of these boards are met UL,TS16949, ISO9001 Etc.

PCB Flow Chart.pdf

Key Specifications of high frequency board :

Production Types:	Rigid communicated PCB
Layer :	6 layer
Base Material :	KB FR4
Copper Thickness :	1oz
Board Thickness :	1.380mm
Min. Finish Hole Size :	8 mil (0.20mm)
Min. Line Width :	4 mil
Min. Line Spacing :	4 mil
Surface Finishing :	HASL LEAD FREE
Drilling hole tolerance:	+/-3 mil ( 0.075mm )
Min Outline tolerance :	+/-4 mil ( 0.10mm )
Working panel size :	max:1200mmX600mm (47'' X24'')
Outline profile:	Punching, Routing , CNC routing + V-cut
Solder mask :	LPI Solder mask, Peelable mask
Solder Mask Color :	Blue, black,yellow, matte green
Certificate :	UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color :	White
Twist and Bow :	no more than 0.75 %

Technology Capability:

Item	Technical Parameters
Layers	1-28 Layers
Inner Layer Min Trace/Space	4/4 mil
Out Layer Min Trace,Space	4/4 mil
Inner Layer Max Copper	4 OZ
Out Layer Max Copper	4 OZ
Inner Layer Min Copper	1/3 oz
Out Layer Min Copper	1/3 oz
Min hole size	0.15 mm
Max.board thickness	6 mm
Min.board thickness	0.2mm
Max.board size	680*1200 mm
PTH Tolerance	+/-0.075mm
NPTH Tolerance	+/-0.05mm
Countersink Tolerance	+/-0.15mm
Board Thickness Tolerance	+/-10%
Min BGA	7mil
Min SMT	7*10 mil
Solder mask bridge	4 mil
Solder mask color	White,black,blue,green,yellow,red,etc
Legend color	White,black,yellow,gray,etc
Surface finish	HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
Board materials	FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
Impedance control	+/-10%
Bow and twist	≤0.5

Products Application:

1, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

2, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

3, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

4, Vehicle Electronices: Car etc;

5, Industrial controls: Medical device ,UPS equipment, Control device etc;

6, Military & Defense : Military Weapons etc;

1.380mm High Density 1 Oz Copper Pcb 4mil Min Line Gold Plating 0

FAQ :

1. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

2. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.

3. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

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Contact Person: sales

Tel: +8615889494185