Name: Gold Plating 1 Oz Copper High Density Circuit Board With Blind Buried Vias
Brand: ACCPCB
SKU: S1021336

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Gold Plating 1 Oz Copper High Density Circuit Board With Blind Buried Vias

Product Details:

Place of Origin:	China
Brand Name:	ACCPCB
Certification:	ISO,SGS,TS16949
Model Number:	S1021336

Payment & Shipping Terms:

Minimum Order Quantity:	1 PCS
Price:	Negotiable
Packaging Details:	Vacuum packing
Delivery Time:	3-5days
Payment Terms:	T/T ,Western Union,Paypal
Supply Ability:	50000SQ.M/Per Month

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Detailed Product Description

Material:	ITEQ FR4 Tg180	Count:	8rigid Layer
Surface Finish:	Immersion Gold	Application:	Minitor Equipment
Solder Mask:	Green	Copper Thickness:	1oz All Layer
Min. Hole Size:	8 Mil/6 Mil	Min. Line Spacing:	4mil
Min. Line Width:	4mil	Service:	Customized PCB
High Light:	1Oz High Density Circuit Board , immersion gold High Density Circuit Board , FR4 tg180 High Density Circuit Board

Gold Plating 1 Oz Copper High Density Circuit Board With Blind Buried Vias

1 Oz Copper High Density PCB with blind and buried vias 4mil Min Line Gold Plating

Production description :

this board is 8layer with 1oz copper thickness. it is used on monitor equipment. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new order. all of these boards are met UL,TS16949, ISO9001 Etc.

Key Specifications of high frequency board :

Production Types:	Rigid communicated PCB
Layer :	8 layer
Base Material :	KB FR4 tg180
Copper Thickness :	1oz
Board Thickness :	1.50mm
Min. Finish Hole Size :	8 mil (0.20mm)
Min. Line Width :	4 mil
Min. Line Spacing :	4 mil
Surface Finishing :	Immersion gold
Drilling hole tolerance:	+/-3 mil ( 0.075mm )
Min Outline tolerance :	+/-4 mil ( 0.10mm )
Working panel size :	max:1200mmX600mm (47'' X24'')
Outline profile:	Punching, Routing , CNC routing + V-cut
Solder mask :	LPI Solder mask, Peelable mask
Solder Mask Color :	Blue, black,yellow, matte green
Certificate :	UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color :	White
Twist and Bow :	no more than 0.75 %

PCB Flow Chart.pdf

Technology Capability:

Item	Technical Parameters
Layers	1-28 Layers
Inner Layer Min Trace/Space	4/4 mil
Out Layer Min Trace,Space	4/4 mil
Inner Layer Max Copper	4 OZ
Out Layer Max Copper	4 OZ
Inner Layer Min Copper	1/3 oz
Out Layer Min Copper	1/3 oz
Min hole size	0.15 mm
Max.board thickness	6 mm
Min.board thickness	0.2mm
Max.board size	680*1200 mm
PTH Tolerance	+/-0.075mm
NPTH Tolerance	+/-0.05mm
Countersink Tolerance	+/-0.15mm
Board Thickness Tolerance	+/-10%
Min BGA	7mil
Min SMT	7*10 mil
Solder mask bridge	4 mil
Solder mask color	White,black,blue,green,yellow,red,etc
Legend color	White,black,yellow,gray,etc
Surface finish	HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
Board materials	FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
Impedance control	+/-10%
Bow and twist	≤0.5

Products Application:

1, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

2, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

3, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

4, Vehicle Electronices: Car etc;

5, Industrial controls: Medical device ,UPS equipment, Control device etc;

6, Military & Defense : Military Weapons etc;

Gold Plating 1 Oz Copper High Density Circuit Board With Blind Buried Vias 0

FAQ :

1. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

2. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.

3. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

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Contact Person: sales

Tel: +8615889494185