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FR4 High Density 2oz Copper Immersion Gold PCB for Wiresss TV application

FR4 High Density 2oz Copper Immersion Gold PCB for Wiresss TV application

  • FR4 High Density 2oz Copper Immersion Gold PCB for Wiresss TV application
  • FR4 High Density 2oz Copper Immersion Gold PCB for Wiresss TV application
FR4 High Density 2oz Copper Immersion Gold PCB for Wiresss TV application
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P113157
Payment & Shipping Terms:
Minimum Order Quantity: 1 pcs
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 5-8DAS
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 30000SQ.M/PER MONTH
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Detailed Product Description
Count Layer: 4layer Copper Thickness: 2 OZ In All Layer
Finish Board Thickness: 1.0mm Solder Mask: Green
Board Size: 900X100mm Min. Line Spacing: 0.1mm
Min. Line Width: 0.1mm Min. Hole Size: 0.1mm
Application: Wilresss TV Solder Mask Color: Green
High Light:

2oz Copper Immersion Gold PCB

,

2oz Immersion Gold PCB

,

FR4 Immersion Gold PCB

FR4 High Density 2oz Copper Immersion Gold PCB for Wiresss TV application
 
Production description :
this board is 4layer with 1oz copper thickness. it is used on  TV . PCB prototype,small volum, middle and large volume are accepted. no MOQ request for new boards. for repeat order, just meet 3sq.m.
 
PCB Flow Chart.pdf
 
Key Specifications/Special Features:

Base material : FR4
Copper thickness : 1 oz layer
Board thickness : 1.60mm
Min. hole size : 0.8mm
Min. line width : 8 mils
Min. line spacing : 8mils
Surface finishing : ENIG
Board thickness tolerance : ±10%
Twist& wrap : ≤ 0.5%
Certificate : RoHS, ISO 9001, UL
Solder Mask Color : Blue, black,yellow, matte green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Twist and Bow : no more than 0.75 %
Outline profile: Punching, Routing , CNC routing + V-cut

 

Technology Capability:

Item Technical Parameters
Layers 1-28 Layers
Inner Layer Min Trace/Space 4/4 mil
Out Layer Min Trace,Space 4/4 mil
Inner Layer Max Copper 4 OZ
Out Layer Max Copper 4 OZ
Inner Layer Min Copper 1/3 oz
Out Layer Min Copper 1/3 oz
Min hole size 0.15 mm
Max.board thickness 6 mm
Min.board thickness 0.2mm
Max.board size 680*1200 mm
PTH Tolerance +/-0.075mm
NPTH Tolerance +/-0.05mm
Countersink Tolerance +/-0.15mm
Board Thickness Tolerance +/-10%
Min BGA 7mil
Min SMT 7*10 mil
Solder mask bridge 4 mil
Solder mask color White,black,blue,green,yellow,red,etc
Legend color White,black,yellow,gray,etc
Surface finish HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
Board materials FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
Impedance control +/-10%
Bow and twist ≤0.5

 

 
FR4 High Density 2oz Copper Immersion Gold PCB for Wiresss TV application 0

 

Application:
1, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;
2, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;
3, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;
4, Vehicle Electronices: Car etc;
5, Industrial controls: Medical device ,UPS equipment, Control device etc;
6, Military & Defense : Military Weapons etc;
 
 
FAQ:
 
1. What kinds of boards can ACCPCB process?
   Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


2. What data are needed for PCB production?
    PCB Gerber files with RS-274-X format.


3. What’s the typical process flow for multi-layer PCB?    
   Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


4. How many types of surface finish ACCPCB can do?
    O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


5. How do ACCPCB ensure quality?
   Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

 

 

 

 
 
 
 

 

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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