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16 Layers Communication PCB 1.0mm thickness Fr4 Material with 1 OZ Copper Thickness

16 Layers Communication PCB 1.0mm thickness Fr4 Material with 1 OZ Copper Thickness

16 Layers Communication PCB 1.0mm thickness Fr4 Material with 1 OZ Copper Thickness
16 Layers Communication PCB 1.0mm thickness Fr4 Material with 1 OZ Copper Thickness
16 Layers Communication PCB 1.0mm thickness Fr4 Material with 1 OZ Copper Thickness
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1116123
Payment & Shipping Terms:
Minimum Order Quantity: 10PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 10-12days
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 30,000SQ.M/Per Month
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Detailed Product Description
Material: FR4 Thickness: 1.0mm
Surface Finish: Immersion Gold Layer: 16L
Copper Thicknes:: 1 Oz In Each Layer PCB Standard: IPC-A-610 D
Type: Customized PCB Min Holes Size: 4mil
Min. Line Width: 4mil Min Copper Thicness: 20um
Solder Mask Color: Green,yellow, Red, Black Etc. Application: LCD Monitor
High Light:

1 OZ Copper Communication PCB

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16 Layers Fr4 Communication PCB

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1 OZ Copper Fr4 PCB

Fr4 Material 16 Layers 1 OZ Copper Communication PCB

16 Layers Communication PCB 1.0mm thickness Fr4 Material with 1 OZ Copper Thickness

 

Production Description :

It is a multilayer PCB boards and used on LCD monitor production.all the products  are Customized  and must meet ISO9001 UL CE ROHS etc. certification with high quality sodering.

 

Key Specifications of Impedance PCB:

Production Types:  Rigid PCB

Layer :

16Layers
Base Material :  FR4 
Copper Thickness :  1 oz
Board Thickness :  2.0mm
Min. Finish Hole Size :  8 mil  (0.10mm)
Min. Line Width :  4 mil
Min. Line Spacing :  4 mil
Surface Finishing : ENIG
Drilling hole tolerance: +/-3 mil    (  0.075mm )
Min Outline tolerance : +/-4 mil    (  0.10mm )
Working panel size :  max:1200mmX600mm (47'' X24'')
Outline profile: Punching, Routing , CNC routing + V-cut
Solder mask : LPI Solder mask, Peelable mask
Solder Mask Color : Blue, black,yellow, matte green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White
Twist and Bow :  no more than 0.75 %

 

PCB Flow Chart.pdf

 

Products Application:

1, Telecom Communication
2, Consumer Electronics
3, Security monitor
4, Vehicle Electronices
5, Smart Home
6, Industrial controls
7, Military & Defense​

 

Rigid PCB Technical Capability:

 Items                                      Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule

sided)

600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

Min.board thickness(multilayer) 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

PTFE,nelcon,

ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
Max.board thickness(single&doule sided) 3.20mm

 

Advantages:
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery

 

Lead Time : 

Lead Time 2 /L 4 /L 6/ L 8/ L
Sample Order 3-5days 6-8days 10-12days 12-14days
Mass Production 7-9days 8-10days 12-15days 15-18days
 
 
16 Layers Communication PCB 1.0mm thickness Fr4 Material with 1 OZ Copper Thickness 0
 

FAQ :

1. How do ACCPCB ensure quality?

   Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process


2. What kinds of boards can ACCPCB process?

    Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

   PCB Gerber files with RS-274-X format.


4. How many types of surface finish ACCPCB can do?

   ACCPCB has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

 

6. How to you make the impedance calculation?

   The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

 

 

 

 

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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