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| Place of Origin: | China |
| Brand Name: | ACCPCB |
| Certification: | ISO, UL, SGS,TS16949 |
| Model Number: | P1038 |
| Minimum Order Quantity: | 1 PCS |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Vacuum packing with desiccant |
| Delivery Time: | 10-15days |
| Payment Terms: | L/C, T/T, Western Union，Paypal |
| Supply Ability: | 30000SQ.M/Per Month |
| Material: | FR4 | Application: | Wireless Device |
|---|---|---|---|
| Cooper Thickness: | 2 Oz Outlayer / 1 Oz Inner Layer | Board Thickness: | 1.20mm |
| Surface Finish: | Immersion Gold | Feature: | Rigid Circuit Boards |
| High Light: | Rigid Communication PCB,Immersion gold Communication PCB,Immersion Gold 6 Layer PCB |
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Wireless Device Rigid Communication PCB With Immersion Gold Surface Finishing
Layer : 6 Layers
Base Material : FR4
Copper Thickness : 2 / 1 / 1 / 2oz,
Board Thickness : 1.20 mm
Min. Hole Size : 6 mil / 0.15 mm
Min. Line Width : 4 / 4 mil
Min. Line Spacing : 4 / 4 mil
Surface Finishing : Immersion gold
Fire-proof level : 94v0
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Rigid PCB Technical Capability:
| Items | Technical Capability | ||
| Layers | 1-28 layers | Min. line width/space | 4mil |
|
Max.board size (single&doule sided) |
600*1200mm | Min.annular ring width: vias | 3mil |
| Surface finish |
HAL lead free,gold flash Immersion silver,Immersion gold ,Immersion Sn, hard gold,OSP,ect |
Min.board thickness(multilayer) | 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
|
| Board materials |
FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic, PTFE,nelcon, ISOLA,polyclad 370 HR); heavy copper, Metal base clade laminate |
Plating thickness (Technique: Immersion Ni/Au) |
Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U'' |
| Impedance control | ± 10% |
Distance between line to board edge |
Outline: 0.2mm V-CUT: 0.4mm |
|
Base copper thickness(Inner and outer layer) |
Min. thickness: 0.5 OZ Max.thickness: 6OZ | Min.hole size(board thickness ≥2mm) | Aspect ratio≤16 |
| Finished copper thickness | Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
|
Max.board thickness(single&doule sided) | 3.20mm |
Quality Goal:
| Category | Performance indicator | Quality Goal |
|
Delivery |
Customer service rate | 99.9% |
| Semi Finished product | Process inspection pass rate | 100% |
| Finished product | FQA Rebate rate | 0.1% |
| Scrapped | 1L scrap rate | 0.5% |
| 2L scrap rate | 1% | |
| Multi Layer scrap rate | 2% | |
| Customers | Customer complaint rate | 0.8% |
| Customer return rate | 0.5% | |
| Customer satisfaction | 99% |
Quality assurance :
Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications
Product Application Field :
FAQ:
1. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
2. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
3. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
Contact Person: sales
Tel: +8615889494185
