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High TG150 2 OZ Copper 10 Layers 1.0mm Impedance PCB

High TG150 2 OZ Copper 10 Layers 1.0mm Impedance PCB

High TG150 2 OZ Copper 10 Layers 1.0mm Impedance PCB
High TG150 2 OZ Copper 10 Layers 1.0mm Impedance PCB
High TG150 2 OZ Copper 10 Layers 1.0mm Impedance PCB
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1116123
Payment & Shipping Terms:
Minimum Order Quantity: 10PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 10-12days
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 30,000SQ.M/Per Month
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Detailed Product Description
Material: FR4 TG150 Thickness: 1.0mm
Surface Finish: Immersion Gold Layer: 10L
Copper Thicknes:: 2oz In Each Layer PCB Standard: IPC-A-610 D
Type: OEM PCB,customized PCB Min Holes Size: 4mil
Min. Line Width: 4mil Min Copper Thicness: 20um
Solder Mask Color: Green,yellow, Red, Black Etc. Application: LCD Monitor
High Light:

1.0mm Impedance PCB

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2 OZ Copper Impedance PCB

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High TG150 Impedance PCB

High TG150 2 OZ Copper 10 Layers 1.0mm Impedance PCB

10 Layers Impedance PCB 1.0mm thickness Fr4 TG150 Material 2 OZ Copper Thickness

 

Production description of Impedance PCB:

Production Types:  Rigid PCB

Layer :

 10 Layers
Base Material :  FR4 tg150
Copper Thickness :  2 /2 / 2 / 2 / oz
Board Thickness :  1.0mm
Min. Finish Hole Size :  8 mil  (0.10mm)
Min. Line Width :  4 mil
Min. Line Spacing :  4 mil
Surface Finishing : ENIG,OSP,HASL,Immersion Gold,Gold Plating
Drilling hole tolerance: +/-3 mil    (  0.075mm )
Min Outline tolerance : +/-4 mil    (  0.10mm )
Working panel size :  max:1200mmX600mm (47'' X24'')
Outline profile: Punching, Routing , CNC routing + V-cut
Solder mask : LPI Solder mask, Peelable mask
Solder Mask Color : Blue, black,yellow, matte green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White
Twist and Bow :  no more than 0.75 %

PCB Flow Chart.pdf

 

Products Application:

1, Consumer Electronics

2, Telecom Communication
3, Vehicle Electronices
4, Security monitor
5, Industrial controls
6, Smart Home
7, Military & Defense

 

Rigid PCB Technical Capability:

 Items                                      Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule

sided)

600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

Min.board thickness(multilayer) 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

PTFE,nelcon,

ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
Max.board thickness(single&doule sided) 3.20mm

 

Lead Time :  

Lead Time 2 /L 4 /L 6/ L 8/ L
Sample Order 3-5days 6-8days 10-12days 12-14days
Mass Production 7-9days 8-10days 12-15days 15-18days
 
High TG150 2 OZ Copper 10 Layers 1.0mm Impedance PCB 0
 

FAQ :
1. What kinds of boards can ACCPCB process?

   Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


2. What data are needed for PCB production?

   PCB Gerber files with RS-274-X format.


3. What’s the typical process flow for multi-layer PCB?

    Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

 

4. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

 

 

 

 

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

Send your inquiry directly to us (0 / 3000)