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| Place of Origin: | China |
| Brand Name: | ACCPCB |
| Certification: | ISO, UL, SGS,TS16949 |
| Model Number: | P111616 |
| Minimum Order Quantity: | 10PCS |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Vacuum packing with desiccant |
| Delivery Time: | 10-12days |
| Payment Terms: | L/C / T/T / Western Union / Paypal |
| Supply Ability: | 30,000SQ.M/Per Month |
| Material: | FR4 Tg150 | Thickness: | 1.20mm |
|---|---|---|---|
| Surface Finish: | Immersion Gold | Layer: | 6L |
| Copper Thicknes:: | 1.50Z | PCB Standard: | IPC-A-610 D |
| Type: | Customized PCB | Min Holes Size: | 4mil |
| Min. Line Width: | 4mil | Min Copper Thicness: | 20um |
| Solder Mask Color: | Bule | Application: | Remote Controller |
| High Light: | 1.2mm Thickness Remote Circuit Board,Tg150 Remote Circuit Board,FR4 Remote Circuit Board |
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6 Layer FR4tg150 1.2mm thickness impedance conrol PCB for remote controller
Production description :
this board is 6 layer with 1.2mm thickness. it is used for remot controller equipment. we can do PCB prototype,small volum, middle and large volume . no MOQ request for new boards. for repeat order, just meet 3sq.m.
Key Specifications of High Voltage PCB:
| Production Types: | Rigid PCB |
|
Layer : |
6Layers |
| Base Material : | FR4 tg150 |
| Copper Thickness : | 1.5oz |
| Board Thickness : | 0.30mm |
| Min. Finish Hole Size : | 8 mil (0.10mm) |
| Min. Line Width : | 4 mil |
| Min. Line Spacing : | 4 mil |
| Surface Finishing : | Immerison gold |
| Drilling hole tolerance: | +/-3 mil ( 0.075mm ) |
| Min Outline tolerance : | +/-4 mil ( 0.10mm ) |
| Working panel size : | max:1200mmX600mm (47'' X24'') |
| Outline profile: | Punching, Routing , CNC routing + V-cut |
| Solder mask : | LPI Solder mask, Peelable mask |
| Solder Mask Color : | Blue |
| Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
| Silkscreen color : | White |
| Twist and Bow : | no more than 0.75 % |
Rigid PCB Technical Capability:
| Items | Technical Capability | ||
| Layers | 1-28 layers | Min. line width/space | 4mil |
|
Max.board size (single&doule sided) |
600*1200mm | Min.annular ring width: vias | 3mil |
| Surface finish |
HAL lead free,gold flash Immersion silver,Immersion gold ,Immersion Sn, hard gold,OSP,ect |
Min.board thickness(multilayer) | 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
|
| Board materials |
FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic, PTFE,nelcon, ISOLA,polyclad 370 HR); heavy copper, Metal base clade laminate |
Plating thickness (Technique: Immersion Ni/Au) |
Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U'' |
| Impedance control | ± 10% |
Distance between line to board edge |
Outline: 0.2mm V-CUT: 0.4mm |
|
Base copper thickness(Inner and outer layer) |
Min. thickness: 0.5 OZ Max.thickness: 6OZ | Min.hole size(board thickness ≥2mm) | Aspect ratio≤16 |
| Finished copper thickness | Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
|
Max.board thickness(single&doule sided) | 3.20mm |
Products Application:
Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consum electronics, computer, automotive, aerospace, military and so on.
FAQ :
1. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
2. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
3. How many types of surface finish ACCPCB can do?
ACCPCB has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
Contact Person: sales
Tel: +8615889494185
