Heavy Copper High Density Interconnect PCB Multilayer Power Wide Application

Heavy Copper PCB High Density Interconnect PCB Multilayer Power Wide Application
 

Production description :

this board is 6layer with 3/2oz copper thickness.  all of these boards are met UL,TS16949, ISO9001 etc. w PCB prototype,samll volum, middle and large volume are accepted . no MOQ request for new order. 

Key Specifications/Special Features:

Quality Goal:
 

 
 
Quality assurance : 
 
Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications
 
 
Product Application Field :
 
 
FAQ
 
1. How do ACCPCB ensure quality?
  Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?
    Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?
    PCB Gerber files with RS-274-X format.