Home ProductsLead Free PCB

Multilayer Rigid ITEQ FR4 1.8OZ TG150 Lead Free PCB Board

Multilayer Rigid ITEQ FR4 1.8OZ TG150 Lead Free PCB Board

Multilayer Rigid ITEQ FR4 1.8OZ TG150 Lead Free PCB Board
Multilayer Rigid ITEQ FR4 1.8OZ TG150 Lead Free PCB Board
Multilayer Rigid ITEQ FR4 1.8OZ TG150 Lead Free PCB Board
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: S1207128
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 10-12days
Payment Terms: L/C / T/T / Western Union / Paypal
Contact Now
Detailed Product Description
Product Name: Multilayer Rigid Boards Thickness: 2.60mm
Size: 250mmX160mm Min. Line Spacing: 0.1MM / 4MIL
Board Thickness: 0.5~3.2mm Surface Finishing: HAL LEAD FREE
Copper Thickness: 1.8OZ Min Line Spacing: 4mil (0.1mm)
Min.line Width: 4 Mil ( 0.1mm) Min Drill Hole Size: 0.2mm
High Light:

TG150 Lead Free PCB Board


1.8OZ Lead Free PCB Board


ITEQ FR4 Lead Free PCB Board

Multilayer Rigid ITEQ FR4 1.8OZ TG150 Lead Free PCB Board


Production Description:

This is a 3layer PCB which is used for power supply. we can accept protype , small volum, middle volume and large volum.  Our PCB is with high quality ,fast deliver and good service after sales.


Key Specifications of amplifier PCB board:

Production Types: ITEQ fiberRigid PCB
Layer : 3 layer
Base Material : FR4 tg150
Copper Thickness : 1.8 oz
Board Thickness : 2.60mm
Min. Finish Hole Size : 8 mil (0.10mm)
Min. Line Width : 4 mil
Min. Line Spacing : 4 mil
Surface Finishing : OSP
Drilling hole tolerance: +/-3 mil ( 0.075mm )
Min Outline tolerance : +/-4 mil ( 0.10mm )
Working panel size : max:1200mmX600mm (47'' X24'')
Outline profile: Punching, Routing , CNC routing + V-cut
Solder mask : LPI Solder mask, Peelable mask
Solder Mask Color : Blue, black,yellow, matte green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White
Twist and Bow : no more than 0.75 %

PCB Chart.pdf


Products Application:

Our products are widely used in consumer electronics products,network, computer peripheral products,optoelectronic products,power supply products, electronic components,electrical mechanical products and so on.


Advantages :
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery


Technical Capability:

 ITEMS Capability
 Max. layer count 28L
 Min. line widty 0.08mm
Min. line spacing 0.08mm
 Min. hole size 0.15mm
 Board thickness 0.4-6.0mm
Max. boardsize 520×620mm
(PTH) Hole size tolerance(PTH) ±0.075mm
(NPTH) Hole size tolerance(NPTH) ) ±0.05mm
Holeposition tolerance(Routing) ±0.1mm
 Outline tolerance(Punching) ±0.1mm



Multilayer Rigid ITEQ FR4 1.8OZ TG150 Lead Free PCB Board 0



1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

  Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?

   PCB Gerber files with RS-274-X format.

4. What’s the typical process flow for multi-layer PCB?

   Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

5. How many types of surface finish ACCPCB can do?

   the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. How to you make the impedance calculation?

   The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.




Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

Send your inquiry directly to us (0 / 3000)