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| Place of Origin: | China |
| Brand Name: | ACCPCB |
| Certification: | ISO, UL, SGS,TS16949 |
| Model Number: | P1110 |
| Minimum Order Quantity: | 5PCS |
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| Price: | Negotiable |
| Packaging Details: | Vacuum packing with desiccant |
| Delivery Time: | 10-12days |
| Payment Terms: | L/C / T/T / Western Union / Paypal |
| Supply Ability: | 30,000SQ.M/Per Month |
| Production Name: | Rigid-flex PCB Board | Material: | FR4+PI |
|---|---|---|---|
| Usage: | Medical Device | Surface Finish: | Immersion Gold |
| Thickness: | Rigid Board-1.6mm+0.12mm -Flex Board | Min. Line Width: | 3 Mil |
| High Light: | double layer pcb,rigid circuit board |
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Rigid Flex PCB Board Assembly 2 Oz Copper Clad For Medical Display Monitor
Key Specifications/Special Features:
| Layer : | 2Layers +1layer |
| Base Material : | FR4 + PI |
| Copper Thickness : | 2oz |
| Board Thickness : | 0.1mm-1.2mm |
| Min. Hole Size : | 6 mil, 0.15mm |
| Min. Line Width : | 6 / 6mil |
| Min. Line Spacing : | 6 /6 mil |
| Surface Finishing : | ENIG(AU:2U'') |
| Solder Mask Color : | Green ,Red,Blue,White,Yellow,Red |
| Silkscreen color : | White,Yellow,Red,Black |
| Outline : | Routing,V-Groove, Beveling punch |
| Company type : | Manufacturer/ Factory |
| Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
Capabilities Overview:
| Item | Technical Parameters |
| Layers | 1-28 Layers |
| Inner Layer Min Trace/Space | 4/4 mil |
| Out Layer Min Trace,Space | 4/4 mil |
| Inner Layer Max Copper | 4 OZ |
| Out Layer Max Copper | 4 OZ |
| Inner Layer Min Copper | 1/3 oz |
| Out Layer Min Copper | 1/3 oz |
| Min hole size | 0.15 mm |
| Max.board thickness | 6 mm |
| Min.board thickness | 0.2mm |
| Max.board size | 680*1200 mm |
| PTH Tolerance | +/-0.075mm |
| NPTH Tolerance | +/-0.05mm |
| Countersink Tolerance | +/-0.15mm |
| Board Thickness Tolerance | +/-10% |
| Min BGA | 7mil |
| Min SMT | 7*10 mil |
| Solder mask bridge | 4 mil |
| Solder mask color | White,black,blue,green,yellow,red,etc |
| Legend color | White,black,yellow,gray,etc |
| Surface finish | HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG |
| Board materials | FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB |
| Impedance control | +/-10% |
| Bow and twist | ≤0.5 |
Advantages:
▪ No MOQ, 14 years of PCB turnkey services
▪ Quick turn, prototype, low & medium & high volume
▪ OEM services provide
▪ ISO 9001-, ISO 14001-, ISO/TS16949, ISO 13485, IATF16949, OHSAS18001 certified
▪ 100% E-test, visual, AOI inspection, including X-ray, 3D microscope
▪ Fast response within 24 hours
Full Range Of Testing Services:
▪ AOI, function testing, In circuit testing
▪ 3D paste thickness test
▪ Flash testing and earth bonding tests can also be undertaken where required
▪ Using our X-ray machine, we test PCBs to component level and all wiring is fully inspected and tested
▪ Each board is carefully examined by our dedicated inspection team using AOI and high magnification viewers
FAQ:
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
Contact Person: sales
Tel: +8615889494185
