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| Place of Origin: | China |
| Brand Name: | ACCPCB |
| Certification: | ISO, UL, SGS,TS16949 |
| Model Number: | S1014 |
| Minimum Order Quantity: | 1PCS |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Vacuum packing with desiccant |
| Delivery Time: | 10days |
| Payment Terms: | L/C / D/P / T/T / Western Union / Paypal |
| Supply Ability: | 30,000SQ.M/Month |
| Material: | FR4 Tg130 | Thickness: | 1.250mm |
|---|---|---|---|
| Surface Finish: | Immersion Tin | Size: | 120mmX120mm |
| Color: | Black Solder Mask | Min. Hole Size: | 0.15MM |
| Copper Thickness: | 35um | Min. Line Width: | 0.1 0mm |
| Min. Line Spacing: | 0.1mm4mil) | Service: | OEM Services Provided |
| High Light: | enig rohs pcb,halogen free pcb |
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8Lyaer Immersion Tin Lead Free PCB Electronic Board Assembly 1.0mm Board Thickness
Production description :
this board is 8 layer PCB it is used on router device. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new boards.
Production Feature:
| Layer : | 8Layers |
| Base Material : | KB FR4 |
| Copper Thickness : | 1/1/1/1/1/1/1/1oz |
| Board Thickness : | 1.250 mm |
| Surface Finish : | Immersion Tin |
| Min. Hole Size : | 6 mil / 0.15mm |
| Min. Line Width : | 4/4 mil, 0.10/0.10 mm |
| Min. Line Spacing : | 4/4mil, 0.10/0.10mm |
| Application : | Router device |
| Certification : | ISO9001, UL, ROHS,TS16949 |
Rigid PCB Technical Capability:
| Items | Technical Capability | ||
| Layers | 1-28 layers | Min. line width/space | 4mil |
|
Max.board size (single&doule sided) |
600*1200mm | Min.annular ring width: vias | 3mil |
| Surface finish |
HAL lead free,gold flash Immersion silver,Immersion gold ,Immersion Sn, hard gold,OSP,ect |
Min.board thickness(multilayer) | 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
|
| Board materials |
FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic, PTFE,nelcon, ISOLA,polyclad 370 HR); heavy copper, Metal base clade laminate |
Plating thickness (Technique: Immersion Ni/Au) |
Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U'' |
| Impedance control | ± 10% |
Distance between line to board edge |
Outline: 0.2mm V-CUT: 0.4mm |
|
Base copper thickness(Inner and outer layer) |
Min. thickness: 0.5 OZ Max.thickness: 6OZ | Min.hole size(board thickness ≥2mm) | Aspect ratio≤16 |
| Finished copper thickness | Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
|
Max.board thickness(single&doule sided) | 3.20mm |
Advantages:
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery
FAQ :
1. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
2. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
3. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
4. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
5. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
Contact Person: sales
Tel: +8615889494185
