Place of Origin: | China |
Brand Name: | ACCPCB |
Certification: | ISO, UL, SGS,TS16949 |
Model Number: | P1094 |
Minimum Order Quantity: | 1PCS |
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Price: | Negotiable |
Packaging Details: | Vacuum packing with desiccant |
Delivery Time: | 10days |
Payment Terms: | L/C / D/P / T/T / Western Union / Paypal |
Supply Ability: | 30,000SQ.M/Month |
Material: | FR4 Tg135 | Thickness: | 1.40mm |
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Surface Finish: | Immersion Silver | Size: | 90mmX100mm |
Color: | Green Solder Mask | Min. Hole Size: | 0.15MM |
High Light: | enig rohs pcb,halogen free pcb |
FR4 TG135 Lead Free PCB , Fr4 Printed Circuit Board Surface Mount for Switch Device
Production description :
this board is 4layer PCB it is used on switch device. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new boards. all PCB are passed UL, TS16949, ISO9001 etc.
Production Feature:
Layer : | 4 Layers |
Base Material : | KB FR4 Tg135 |
Copper Thickness : | 1oz in all layer |
Board Thickness : | 1.40 mm |
Surface Finish : | Immersion Silver |
Min. Hole Size : | 6 mil, 0.15mm |
Min. Line Width : | 4/4 mil, 0.10/0.10 mm |
Min. Line Spacing : | 4/4mil, 0.10/0.10mm |
Application : | Switch device |
Certification : | ISO9001, UL, ROHS,TS16949 |
Technology Capability :
Item | Technical Parameters |
Layers | 1-28 Layers |
Inner Layer Min Trace/Space | 4/4 mil |
Out Layer Min Trace,Space | 4/4 mil |
Inner Layer Max Copper | 4 OZ |
Out Layer Max Copper | 4 OZ |
Inner Layer Min Copper | 1/3 oz |
Out Layer Min Copper | 1/3 oz |
Min hole size | 0.15 mm |
Max.board thickness | 6 mm |
Min.board thickness | 0.2mm |
Max.board size | 680*1200 mm |
PTH Tolerance | +/-0.075mm |
NPTH Tolerance | +/-0.05mm |
Countersink Tolerance | +/-0.15mm |
Board Thickness Tolerance | +/-10% |
Min BGA | 7mil |
Min SMT | 7*10 mil |
Solder mask bridge | 4 mil |
Solder mask color | White,black,blue,green,yellow,red,etc |
Legend color | White,black,yellow,gray,etc |
Surface finish | HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG |
Board materials | FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB |
Impedance control | +/-10% |
Bow and twist | ≤0.5 |
Advantages :
▪ No MOQ, 14 years of PCB turnkey services
▪ Quick turn, prototype, low & medium & high volume
▪ OEM services provide
▪ ISO 9001-, ISO 14001-, ISO/TS16949, ISO 13485, IATF16949, OHSAS18001 certified
▪ 100% E-test, visual, AOI inspection, including X-ray, 3D microscope
▪ Fast response within 24 hours
FAQ :
1. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
2. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
3. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
4. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
5. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
Contact Person: sales
Tel: +8615889494185